Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385128 | Cooling device and process for cooling double-sided SiP devices during sputtering | HunTeak Lee, Sell Jung, HeeSoo Lee | 2025-08-12 |
| 11932933 | Cooling device and process for cooling double-sided SiP devices during sputtering | HunTeak Lee, Sell Jung, HeeSoo Lee | 2024-03-19 |
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2023-12-12 |
| 11434561 | Cooling device and process for cooling double-sided SiP devices during sputtering | HunTeak Lee, Sell Jung, HeeSoo Lee | 2022-09-06 |
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, HunTeak Lee, HeeSoo Lee | 2022-06-21 |
| 11342294 | Semiconductor device and method of forming protrusion e-bar for 3D SiP | DeokKyung Yang, HunTeak Lee, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2022-05-24 |
| 11309193 | Semiconductor device and method of forming SIP module over film layer | Kyunghwan KIM, WoonJae Beak, HunTeak Lee, InSang Yoon | 2022-04-19 |
| 10804119 | Method of forming SIP module over film layer | Kyunghwan KIM, WoonJae Beak, HunTeak Lee, InSang Yoon | 2020-10-13 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2020-10-06 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, HunTeak Lee, HeeSoo Lee | 2020-06-30 |
| 10636756 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | DeokKyung Yang, HunTeak Lee, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2020-04-28 |
| 10629565 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, InSang Yoon | 2020-04-21 |
| 10418341 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, InSang Yoon | 2019-09-17 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2019-08-20 |
| 10163744 | Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure | WonJun Ko, DaeSik Choi | 2018-12-25 |
| 9543258 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | Sunmi Kim, KyungHoon Lee | 2017-01-10 |
| 9478486 | Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV | Sun Mi Kim, KyungHoon Lee | 2016-10-25 |
| 9373578 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | DaeSik Choi, SungWon Cho | 2016-06-21 |
| 9293349 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | Sunmi Kim, KyungHoon Lee | 2016-03-22 |
| 9279673 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | WonJun Ko, SeungYong Chai, GwangTae Kim, Kenny Lee | 2016-03-08 |
| 9123663 | Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor | Seungwon Kim, JoungUn Park | 2015-09-01 |
| 8900921 | Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV | Sun Mi Kim, KyungHoon Lee | 2014-12-02 |
| 8884339 | Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process | KiYoun Jang, DaeSik Choi, DongSoo Moon | 2014-11-11 |
| 8786076 | Semiconductor device and method of forming a thermally reinforced semiconductor die | YongHee Kang, KyungHoon Lee | 2014-07-22 |
| 8709935 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | DaeSik Choi, SungWon Cho | 2014-04-29 |