Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385128 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, HunTeak Lee, HeeSoo Lee | 2025-08-12 |
| 11932933 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, HunTeak Lee, HeeSoo Lee | 2024-03-19 |
| 11434561 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, HunTeak Lee, HeeSoo Lee | 2022-09-06 |
| 9093415 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | Oh Han Kim, HeeSoo Lee, Jae Han Chung, YoungChul Kim | 2015-07-28 |