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Integrated circuit packaging system with heat spreader and method of manufacture thereof |
Sell Jung, HeeSoo Lee, Jae Han Chung, YoungChul Kim |
2015-07-28 |
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Integrated circuit packaging system with substrate mold gate and method of manufacture thereof |
Haengcheol Choi, KyungOe Kim |
2014-10-14 |
| 8748233 |
Integrated circuit packaging system with underfill and method of manufacture thereof |
DaeSik Choi, Jung Sell |
2014-06-10 |
| 8709934 |
Electronic system with vertical intermetallic compound |
BaeYong Kim, Bongsuk Choi |
2014-04-29 |
| 8633586 |
Mock bump system for flip chip integrated circuits |
BaeYong Kim, Youngmin Kim |
2014-01-21 |
| 8604624 |
Flip chip interconnection system having solder position control mechanism |
Kyung-Moon Kim |
2013-12-10 |
| 8536718 |
Integrated circuit packaging system with trenches and method of manufacture thereof |
WonJun Ko |
2013-09-17 |
| 8513057 |
Integrated circuit packaging system with routable underlayer and method of manufacture thereof |
Ki Youn Jang, DaeSik Choi, DongSoo Moon |
2013-08-20 |
| 8466567 |
Integrated circuit packaging system with stack interconnect and method of manufacture thereof |
DaeSik Choi, SangMi Park |
2013-06-18 |
| 8409923 |
Integrated circuit packaging system with underfill and method of manufacture thereof |
Yong Hee Kang, DaeSik Choi |
2013-04-02 |
| 7956449 |
Stacked integrated circuit package system |
KyungHoon Lee |
2011-06-07 |