Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9093415 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | Sell Jung, HeeSoo Lee, Jae Han Chung, YoungChul Kim | 2015-07-28 |
| 8859342 | Integrated circuit packaging system with substrate mold gate and method of manufacture thereof | Haengcheol Choi, KyungOe Kim | 2014-10-14 |
| 8748233 | Integrated circuit packaging system with underfill and method of manufacture thereof | DaeSik Choi, Jung Sell | 2014-06-10 |
| 8709934 | Electronic system with vertical intermetallic compound | BaeYong Kim, Bongsuk Choi | 2014-04-29 |
| 8633586 | Mock bump system for flip chip integrated circuits | BaeYong Kim, Youngmin Kim | 2014-01-21 |
| 8604624 | Flip chip interconnection system having solder position control mechanism | Kyung-Moon Kim | 2013-12-10 |
| 8536718 | Integrated circuit packaging system with trenches and method of manufacture thereof | WonJun Ko | 2013-09-17 |
| 8513057 | Integrated circuit packaging system with routable underlayer and method of manufacture thereof | Ki Youn Jang, DaeSik Choi, DongSoo Moon | 2013-08-20 |
| 8466567 | Integrated circuit packaging system with stack interconnect and method of manufacture thereof | DaeSik Choi, SangMi Park | 2013-06-18 |
| 8409923 | Integrated circuit packaging system with underfill and method of manufacture thereof | Yong Hee Kang, DaeSik Choi | 2013-04-02 |
| 7956449 | Stacked integrated circuit package system | KyungHoon Lee | 2011-06-07 |