WK

WonJun Ko

SC Stats Chippac: 17 patents #53 of 425Top 15%
Overall (All Time): #275,502 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10163744 Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure OhHan Kim, DaeSik Choi 2018-12-25
9279673 Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage SeungYong Chai, OhHan Kim, GwangTae Kim, Kenny Lee 2016-03-08
9252032 Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias DaeSik Choi, JaEun Yun 2016-02-02
9076802 Dual-sided film-assist molding process GwangTae Kim, KeoChang Lee 2015-07-07
8618653 Integrated circuit package system with wafer scale heat slug Taeg Ki Lim, Sungmin Song 2013-12-31
8609463 Integrated circuit package system employing multi-package module techniques SeungYun Ahn, DongSoo Moon 2013-12-17
8569882 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof Sungmin Song, Jong Wook Ju, JaEun Yun, Hye Ran Lee 2013-10-29
8546957 Integrated circuit packaging system with dielectric support and method of manufacture thereof DeokKyung Yang, Yeongbeom Ko 2013-10-01
8536718 Integrated circuit packaging system with trenches and method of manufacture thereof Oh Han Kim 2013-09-17
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue JaEun Yun, HunTeak Lee, SeungYong Chai 2013-09-03
8415204 Integrated circuit packaging system with heat spreader and method of manufacture thereof JaEun Yun, Jong Wook Ju, Hye Ran Lee 2013-04-09
8263435 Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias DaeSik Choi, JaEun Yun 2012-09-11
8227925 Integrated circuit packaging system with interposer Sungmin Song, Seongmin Lee 2012-07-24
8124451 Integrated circuit packaging system with interposer Sungmin Song, Seongmin Lee 2012-02-28
8067275 Integrated circuit package system with package integration Jong Wook Ju, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun 2011-11-29
8035211 Integrated circuit package system with support structure under wire-in-film adhesive BoHan Yoon, JoungUn Park 2011-10-11
8022538 Base package system for integrated circuit package stacking and method of manufacture thereof NamJu Cho 2011-09-20