Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163744 | Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure | OhHan Kim, DaeSik Choi | 2018-12-25 |
| 9279673 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | SeungYong Chai, OhHan Kim, GwangTae Kim, Kenny Lee | 2016-03-08 |
| 9252032 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | DaeSik Choi, JaEun Yun | 2016-02-02 |
| 9076802 | Dual-sided film-assist molding process | GwangTae Kim, KeoChang Lee | 2015-07-07 |
| 8618653 | Integrated circuit package system with wafer scale heat slug | Taeg Ki Lim, Sungmin Song | 2013-12-31 |
| 8609463 | Integrated circuit package system employing multi-package module techniques | SeungYun Ahn, DongSoo Moon | 2013-12-17 |
| 8569882 | Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof | Sungmin Song, Jong Wook Ju, JaEun Yun, Hye Ran Lee | 2013-10-29 |
| 8546957 | Integrated circuit packaging system with dielectric support and method of manufacture thereof | DeokKyung Yang, Yeongbeom Ko | 2013-10-01 |
| 8536718 | Integrated circuit packaging system with trenches and method of manufacture thereof | Oh Han Kim | 2013-09-17 |
| 8524537 | Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue | JaEun Yun, HunTeak Lee, SeungYong Chai | 2013-09-03 |
| 8415204 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | JaEun Yun, Jong Wook Ju, Hye Ran Lee | 2013-04-09 |
| 8263435 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | DaeSik Choi, JaEun Yun | 2012-09-11 |
| 8227925 | Integrated circuit packaging system with interposer | Sungmin Song, Seongmin Lee | 2012-07-24 |
| 8124451 | Integrated circuit packaging system with interposer | Sungmin Song, Seongmin Lee | 2012-02-28 |
| 8067275 | Integrated circuit package system with package integration | Jong Wook Ju, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun | 2011-11-29 |
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | BoHan Yoon, JoungUn Park | 2011-10-11 |
| 8022538 | Base package system for integrated circuit package stacking and method of manufacture thereof | NamJu Cho | 2011-09-20 |