WonJun Ko — 17 Patents at Stats Chippac

WonJun Ko has been granted 17 US patents while listed as an inventor at Stats Chippac. The first was granted in 2011 and the most recent in December 2018. WonJun Ko ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list WonJun Ko in Seojong-myeon, KR.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date
10163744	Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure	OhHan Kim, DaeSik Choi	2018-12-25
9279673	Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage	SeungYong Chai, OhHan Kim, GwangTae Kim, Kenny Lee	2016-03-08
9252032	Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias	DaeSik Choi, JaEun Yun	2016-02-02
9076802	Dual-sided film-assist molding process	GwangTae Kim, KeoChang Lee	2015-07-07
8618653	Integrated circuit package system with wafer scale heat slug	Taeg Ki Lim, Sungmin Song	2013-12-31
8609463	Integrated circuit package system employing multi-package module techniques	SeungYun Ahn, DongSoo Moon	2013-12-17
8569882	Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof	Sungmin Song, Jong Wook Ju, JaEun Yun, Hye Ran Lee	2013-10-29
8546957	Integrated circuit packaging system with dielectric support and method of manufacture thereof	DeokKyung Yang, Yeongbeom Ko	2013-10-01
8536718	Integrated circuit packaging system with trenches and method of manufacture thereof	Oh Han Kim	2013-09-17
8524537	Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue	JaEun Yun, HunTeak Lee, SeungYong Chai	2013-09-03
8415204	Integrated circuit packaging system with heat spreader and method of manufacture thereof	JaEun Yun, Jong Wook Ju, Hye Ran Lee	2013-04-09
8263435	Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias	DaeSik Choi, JaEun Yun	2012-09-11
8227925	Integrated circuit packaging system with interposer	Sungmin Song, Seongmin Lee	2012-07-24
8124451	Integrated circuit packaging system with interposer	Sungmin Song, Seongmin Lee	2012-02-28
8067275	Integrated circuit package system with package integration	Jong Wook Ju, SeungYong Chai, Taeg Ki Lim, Ja Eun Yun	2011-11-29
8035211	Integrated circuit package system with support structure under wire-in-film adhesive	BoHan Yoon, JoungUn Park	2011-10-11
8022538	Base package system for integrated circuit package stacking and method of manufacture thereof	NamJu Cho	2011-09-20

WonJun Ko — 17 Patents

Issued Patents All Time

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