Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8994196 | System and method for directional grinding on backside of a semiconductor wafer | Sungyoon Lee, Junghoon Shin | 2015-03-31 |
| 8035211 | Integrated circuit package system with support structure under wire-in-film adhesive | WonJun Ko, JoungUn Park | 2011-10-11 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer | Sungyoon Lee, Junghoon Shin | 2011-02-22 |
| 7659140 | Integrated circuit system with a debris trapping system | Taewoo Lee, Sang Ho Lee | 2010-02-09 |