Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136144 | Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation | TaegKi Lim, JaEun Yun | 2015-09-15 |
| 8994196 | System and method for directional grinding on backside of a semiconductor wafer | Junghoon Shin, BoHan Yoon | 2015-03-31 |
| 8704366 | Ultra thin bumped wafer with under-film | Junghoon Shin, Sangho Lee | 2014-04-22 |
| 8329554 | Ultra thin bumped wafer with under-film | Junghoon Shin, Sangho Lee | 2012-12-11 |
| 8030769 | Grooving bumped wafer pre-underfill system | Junghoon Shin, Taewoo Lee | 2011-10-04 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer | Junghoon Shin, BoHan Yoon | 2011-02-22 |
| 7838391 | Ultra thin bumped wafer with under-film | Junghoon Shin, Sangho Lee | 2010-11-23 |
| 7727875 | Grooving bumped wafer pre-underfill system | Junghoon Shin, Taewoo Lee | 2010-06-01 |