Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136144 | Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation | JaEun Yun, Sungyoon Lee | 2015-09-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136144 | Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation | JaEun Yun, Sungyoon Lee | 2015-09-15 |