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Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias |
DaeSik Choi, WonJun Ko |
2016-02-02 |
| 9136144 |
Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation |
TaegKi Lim, Sungyoon Lee |
2015-09-15 |
| 8569882 |
Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof |
WonJun Ko, Sungmin Song, Jong Wook Ju, Hye Ran Lee |
2013-10-29 |
| 8524537 |
Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue |
HunTeak Lee, SeungYong Chai, WonJun Ko |
2013-09-03 |
| 8415204 |
Integrated circuit packaging system with heat spreader and method of manufacture thereof |
Jong Wook Ju, WonJun Ko, Hye Ran Lee |
2013-04-09 |
| 8263435 |
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias |
DaeSik Choi, WonJun Ko |
2012-09-11 |
| 7969023 |
Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof |
Taeg Ki Lim, Byung Joon Han |
2011-06-28 |