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Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof |
In Sang Yoon, DeokKyung Yang |
2018-09-25 |
| 9385066 |
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof |
In Sang Yoon, DeokKyung Yang |
2016-07-05 |
| 9355962 |
Integrated circuit package stacking system with redistribution and method of manufacture thereof |
Seongmin Lee, Jong-Woo Ha |
2016-05-31 |
| 9330945 |
Integrated circuit package system with multi-chip module |
SeungYun Ahn, JoHyun Bae, Jong-Woo Ha |
2016-05-03 |
| 9234038 |
Compositions and method for the diagnosis, prevention and treatment of alzheimer's disease |
Yong-Keun Jung |
2016-01-12 |
| 8779562 |
Integrated circuit packaging system with interposer shield and method of manufacture thereof |
Seongmin Lee, SeongHun Mun |
2014-07-15 |
| 8772916 |
Integrated circuit package system employing mold flash prevention technology |
Ki Youn Jang, JoHyun Bae |
2014-07-08 |
| 8765525 |
Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer |
In Sang Yoon, DeokKyung Yang |
2014-07-01 |
| 8618653 |
Integrated circuit package system with wafer scale heat slug |
WonJun Ko, Taeg Ki Lim |
2013-12-31 |
| 8569882 |
Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof |
WonJun Ko, Jong Wook Ju, JaEun Yun, Hye Ran Lee |
2013-10-29 |
| 8501535 |
Integrated circuit package system with dual side connection and method for manufacturing thereof |
SeungYun Ahn, JoHyun Bae |
2013-08-06 |
| 8252615 |
Integrated circuit package system employing mold flash prevention technology |
Ki Youn Jang, JoHyun Bae |
2012-08-28 |
| 8227925 |
Integrated circuit packaging system with interposer |
Seongmin Lee, WonJun Ko |
2012-07-24 |
| 8130512 |
Integrated circuit package system and method of package stacking |
In Sang Yoon, Seongmin Lee |
2012-03-06 |
| 8124358 |
Methods of screening for compounds that inhibit binding between amyloid-β(Aβ) and FC-γ receptor IIB (FcγRIIb) |
Yong-Keun Jung |
2012-02-28 |
| 8124451 |
Integrated circuit packaging system with interposer |
Seongmin Lee, WonJun Ko |
2012-02-28 |
| 7919871 |
Integrated circuit package system for stackable devices |
DongSoo Moon |
2011-04-05 |
| 7884457 |
Integrated circuit package system with dual side connection |
SeungYun Ahn, JoHyun Bae |
2011-02-08 |
| 7871861 |
Stacked integrated circuit package system with intra-stack encapsulation |
Junwoo Myung, Byoung Wook Jang |
2011-01-18 |
| 7667314 |
Integrated circuit package system with mold lock subassembly |
In Sang Yoon |
2010-02-23 |
| 7482203 |
Stacked integrated circuit package-in-package system |
Choong Bin Yim, Seongmin Lee, Jaehyun LIM, JoungIn Yang, DongSam Park |
2009-01-27 |
| 7312519 |
Stacked integrated circuit package-in-package system |
Choong Bin Yim, Seongmin Lee, Jaehyun LIM, JoungIn Yang, DongSam Park |
2007-12-25 |
| 7298037 |
Stacked integrated circuit package-in-package system with recessed spacer |
Choong Bin Yim, Seongmin Lee, Jaehyun LIM, JoungIn Yang, DongSam Park |
2007-11-20 |