Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Seok Geun Ahn, Min-Keun Kwak, Ji Won Shin, Sang Hoon Lee | 2022-10-11 |
| 11133296 | Semiconductor package | Chanhee Jeong, Hyunki Kim, Junwoo Park, Sunchul Kim, Su-Min Park +3 more | 2021-09-28 |
| 10622340 | Semiconductor package | Chanhee Jeong, Hyunki Kim, Junwoo Park, Sunchul Kim, Su-Min Park +3 more | 2020-04-14 |
| 10510672 | Semiconductor packages and methods of manufacturing same | Sang-Uk Kim, Sunchul Kim, Jinkyeong Seol | 2019-12-17 |
| 9899487 | Semiconductor devices and methods of manufacturing the same | Myeong-Dong Lee, Hye Young Kang, Young-Sin Kim, Yong Kwan Kim, Augustin J. Hong +2 more | 2018-02-20 |
| 9370098 | Package substrates and integrated circuit packages including the same | Jongkook Kim, Su-Min Park | 2016-06-14 |
| 9349713 | Semiconductor package stack structure having interposer substrate | Jong Kook Kim | 2016-05-24 |
| 8847413 | Integrated circuit package system with leads having multiple sides exposed | Jae Hak Yee | 2014-09-30 |
| 8810019 | Integrated circuit package system with stacked die | Jae Hak Yee, Junwoo Myung | 2014-08-19 |
| 8501540 | Method for manufacture of inline integrated circuit system | Jae Hak Yee, Junwoo Myung, YoungChul Kim | 2013-08-06 |
| 8481420 | Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof | Jong-Woo Ha, DaeSik Choi | 2013-07-09 |
| 8405197 | Integrated circuit packaging system with stacked configuration and method of manufacture thereof | Jong-Woo Ha, DaeSik Choi | 2013-03-26 |
| 8138591 | Integrated circuit package system with stacked die | Jae Hak Yee, Junwoo Myung | 2012-03-20 |
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DaeSik Choi, DeokKyung Yang, Jong-Woo Ha, JaeSick Bae, Seung-Won Kim | 2011-08-09 |
| 7968981 | Inline integrated circuit system | Jae Hak Yee, Junwoo Myung, YoungChul Kim | 2011-06-28 |
| 7871861 | Stacked integrated circuit package system with intra-stack encapsulation | Sungmin Song, Junwoo Myung | 2011-01-18 |
| 7863737 | Integrated circuit package system with wire bond pattern | Hun Teak Lee, Kwang Soon Hwang | 2011-01-04 |
| 7683467 | Integrated circuit package system employing structural support | Young Cheol Kim, Koo Hong Lee | 2010-03-23 |