Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418004 | Semiconductor package and method of fabricating the same | — | 2025-09-16 |
| 12033970 | Semiconductor device and manufacturing method thereof | Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang +2 more | 2024-07-09 |
| 11562965 | Semiconductor package | Sun Chul Kim, Sang-Soo Kim, Yong Kwan Lee, Hyun Ki Kim, Jun Young Oh | 2023-01-24 |
| 11515262 | Semiconductor package and method of fabricating the same | JuHyung Lee, Sunchul Kim | 2022-11-29 |
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Min-Keun Kwak, Ji Won Shin, Sang Hoon Lee, Byoung Wook Jang | 2022-10-11 |
| 11018107 | Semiconductor device | Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang +2 more | 2021-05-25 |
| 10340244 | Semiconductor device and manufacturing method thereof | Jae Hun Bae, Won Chul Do, Min Yoo, Young Rae Kim, Min Hwa Chang +2 more | 2019-07-02 |