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Ji Won Shin

Samsung: 2 patents #37,631 of 75,807Top 50%
Overall (All Time): #1,421,985 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11469133 Bonding apparatus and semiconductor package fabrication equipment including the same Seok Geun Ahn, Min-Keun Kwak, Sang Hoon Lee, Byoung Wook Jang 2022-10-11
9681953 Complex support body for regenerating bone-cartilage, method for manufacturing thereof, and composition for treating bone and cartilage related diseases comprising same as active ingredient Jung Woog Shin, So Hee Park 2017-06-20
9376541 Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package Un-Byoung Kang, Kyung Wook Paik, Tae-Je Cho, Young Kun Jee, Sun-kyoung Seo +1 more 2016-06-28