Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923283 | Semiconductor package and method for fabricating the same | — | 2024-03-05 |
| 11862570 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Hyun Ki Kim, Hyung-Gil Baek, Yong Kwan Lee | 2024-01-02 |
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Seok Geun Ahn, Ji Won Shin, Sang Hoon Lee, Byoung Wook Jang | 2022-10-11 |
| 11450614 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Hyun Ki Kim, Hyung-Gil Baek, Yong Kwan Lee | 2022-09-20 |
| 10747123 | Semiconductor device having overlay pattern | Tae Sun Kim, Young-Sik Park, Byoung Hoon Kim, Yong Chul Kim, Hyun Jeong Lee +1 more | 2020-08-18 |
| 10573633 | Semiconductor device including overlay patterns | Tae Sun Kim, Hyun Jae Kang, Tae-Hoi Park, Jin Seong LEE, Eun Sol Choi +2 more | 2020-02-25 |
| 9105694 | Method for fabricating semiconductor device | Jong Ho Lee, Bum-Joon Youn, Sung Won Choi | 2015-08-11 |
| 7812265 | Semiconductor package, printed circuit board, and electronic device | Mu-Seob Shin, Byung-Seo Kim, Min Young Son | 2010-10-12 |
| 7498193 | Package with barrier wall and method for manufacturing the same | Il-Ki Kim | 2009-03-03 |
| 7414303 | Lead on chip semiconductor package | Sang-Hyeop Lee, Se-Yong Oh, Jin Ho Kim, Chan-Suk Lee, Sung Hwan Yoon +1 more | 2008-08-19 |
| 7166906 | Package with barrier wall and method for manufacturing the same | Il-Ki Kim | 2007-01-23 |
| 7064435 | Semiconductor package with improved ball land structure | Myung-Kee Chung, Kil-Soo Kim | 2006-06-20 |