Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051680 | Semiconductor package aligning interposer and substrate | Tae Hwan Kim, Hyung-Gil Baek, Young-Ja Kim, Kang Gyune Lee, Sang Won Lee | 2024-07-30 |
| 11955359 | Magazine supporting equipment and semiconductor manufacturing apparatus including the same | Jun Young Oh, Seung Hwan Kim, Jong-Ho Park, Jong Ho Lee | 2024-04-09 |
| 11862570 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Min-Keun Kwak, Hyun Ki Kim, Hyung-Gil Baek | 2024-01-02 |
| 11699626 | Semiconductor package and method of manufacturing the same | Jun Young Oh, Hyun Ki Kim, Sang-Soo Kim, Seung Hwan Kim | 2023-07-11 |
| 11562965 | Semiconductor package | Sun Chul Kim, Sang-Soo Kim, Hyun Ki Kim, Seok Geun Ahn, Jun Young Oh | 2023-01-24 |
| 11450614 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Min-Keun Kwak, Hyun Ki Kim, Hyung-Gil Baek | 2022-09-20 |
| 11069588 | Semiconductor package and method of manufacturing the same | Jun Young Oh, Hyun Ki Kim, Sang-Soo Kim, Seung Hwan Kim | 2021-07-20 |
| 10756075 | Package-on-package type semiconductor package and method for manufacturing the same | Min Gi Hong | 2020-08-25 |
| 10607905 | Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region | Baek KI, Tark-Hyun Ko, Kun-dae Yeom, Keun-Ho Jang | 2020-03-31 |
| 10361135 | Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrate | Baek KI, Tark-Hyun Ko, Kun-dae Yeom, Keun-Ho Jang | 2019-07-23 |
| 9747827 | Driving circuit of display device for compensating image data and method for driving the same | Seung-Pyo Seo | 2017-08-29 |
| 9642238 | Antenna structure and plasma generating device | — | 2017-05-02 |
| 9357652 | Method of manufacturing circuit board and semiconductor package | Hee Jeong Kim | 2016-05-31 |
| 9282624 | Antenna structure and plasma generating device | — | 2016-03-08 |
| 9041180 | Semiconductor package and method of manufacturing the semiconductor package | — | 2015-05-26 |
| 8304925 | Movable object type high-efficiency wave energy apparatus | Dong-soon Yang, Byung-Hak Cho | 2012-11-06 |
| 8241968 | Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package | Tae-Sung Park, Won Keun Kim | 2012-08-14 |
| 8213112 | Motor having a pressure difference generation portion disposed in a space between a disk and rotor case and disk drive apparatus including the motor | Elr Soo Youn, Soo Woong Park, Chang Keun Jun | 2012-07-03 |
| 8035056 | Plasma generation apparatus | Gi-Chung Kwon, Sang Won Lee, Sae-Hoon Uhm, Jae-Hyun Kim, Bo-Han Hong | 2011-10-11 |
| 7442273 | Apparatus using hybrid coupled plasma | Gi-Chung Kwon, Hong-Young Chang | 2008-10-28 |
| 7411148 | Plasma generation apparatus | Gi-Chung Kwon, Sang Won Lee, Sae-Hoon Uhm, Jae-Hyun Kim, Bo-Han Hong | 2008-08-12 |
| 7088047 | Inductively coupled plasma generator having low aspect ratio | Won-Bong Jung, Sang Won Lee, Sae-Hoon Uhm, Dong-Seok Lee | 2006-08-08 |
| 6288493 | Antenna device for generating inductively coupled plasma | Nam-Sik Yoon, Sung-Sik Kim, Pyung-Woo Lee, Hong-Young Chang | 2001-09-11 |