| 10607905 |
Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region |
Baek KI, Tark-Hyun Ko, Yong Kwan Lee, Keun-Ho Jang |
2020-03-31 |
| 10361135 |
Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrate |
Baek KI, Tark-Hyun Ko, Yong Kwan Lee, Keun-Ho Jang |
2019-07-23 |
| 9455217 |
Semiconductor package including multiple chips and separate groups of leads |
Chul-Sung Park, Hyeong-Seob Kim, Gwang-Man Lim |
2016-09-27 |
| 9041181 |
Land grid array package capable of decreasing a height difference between a land and a solder resist |
Hee Chul Lee, Myung-Kee Chung |
2015-05-26 |
| 8901750 |
Semiconductor package including multiple chips and separate groups of leads |
Chul-Hong Park, Hyeong-Seob Kim, Gwang-Man Lim |
2014-12-02 |
| 8723333 |
Semiconductor package including multiple chips and separate groups of leads |
Chul-Hong Park, Hysong-seob Kim, Gwang-Man Lim |
2014-05-13 |
| 8664757 |
High density chip stacked package, package-on-package and method of fabricating the same |
Yun-Rae Cho |
2014-03-04 |
| 8193626 |
Semiconductor package including multiple chips and separate groups of leads |
Chul-Hong Park, Hysong-seob Kim, Gwang-Man Lim |
2012-06-05 |
| 7759795 |
Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same |
Young Lyong Kim, Young-shin Choi, Jong Gi LEE, Chul-Yong Jang, Hyun Jong Woo |
2010-07-20 |
| 7521289 |
Package having dummy package substrate and method of fabricating the same |
Young-Min Lee |
2009-04-21 |
| 7391105 |
Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same |
— |
2008-06-24 |
