Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784137 | Semiconductor device and method for fabricating the same | Ae-Nee Jang, Seung Hun Han | 2023-10-10 |
| 11158589 | Semiconductor device and semiconductor package comprising the same | Seung Hun Han, Nam-Gyu Baek, Ae-Nee Jang | 2021-10-26 |
| 10950586 | Semiconductor devices having upper and lower solder portions and methods of fabricating the same | — | 2021-03-16 |
| 10930602 | Semiconductor device and method for fabricating the same | Ae-Nee Jang, Seung Hun Han | 2021-02-23 |
| 10923407 | Semiconductor device | Sundae KIM, Namgyu Baek, Seokhyun Lee | 2021-02-16 |
| 10916509 | Substrate, method of sawing substrate, and semiconductor device | Sundae KIM, Hyunggil Baek, Namgyu Baek, Seunghun Shin, Donghoon Won | 2021-02-09 |
| 10643958 | Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device | Sun-dae Kim, Hyung-Gil Baek, Nam-Gyu Baek | 2020-05-05 |
| 10559543 | Semiconductor device having a protection trench, semiconductor wafer including the same, and semiconductor package | Sundae KIM, Namgyu Baek | 2020-02-11 |
| 10490514 | Semiconductor devices | Nam-Gyu Baek, Hyung-Gil Baek, Sun-dae Kim | 2019-11-26 |
| 10418335 | Substrate, method of sawing substrate, and semiconductor device | Sundae KIM, Hyunggil Baek, Namgyu Baek, Seunghun Shin, Donghoon Won | 2019-09-17 |
| 10304781 | Semiconductor devices including guard ring and crack sensing circuit | Nam-Gyu Baek, Hyung-Gil Baek, Sun-dae Kim | 2019-05-28 |
| 10103109 | Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device | Sun-dae Kim, Hyung-Gil Baek, Nam-Gyu Baek | 2018-10-16 |
| 9984945 | Semiconductor chip | Sun-dae Kim, Nam-Gyu Baek, Hyung-Gil Baek | 2018-05-29 |
| 9716048 | Semiconductor device having a peripheral-region defect detection structure | Sundae KIM, Namgyu Baek, Seokhyun Lee | 2017-07-25 |
| 9570411 | Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure | Nam-Gyu Baek, Young-Min Lee, Sun-dae Kim | 2017-02-14 |
| 9553074 | Semiconductor package having cascaded chip stack | — | 2017-01-24 |
| 9543275 | Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same | Jong-oh Kwon | 2017-01-10 |
| 9099460 | Stack semiconductor package and manufacturing the same | Tae Hoon Kim, Ho-Geon Song, Seok-Won Lee | 2015-08-04 |
| 8946909 | Semiconductor package having gap-filler injection-friendly structure | Young-Min Lee | 2015-02-03 |
| 8890294 | Stack semiconductor package and manufacturing the same | Tae Hoon Kim, Ho-Geon Song, Seok-Won Lee | 2014-11-18 |
| 8823171 | Semiconductor package, semiconductor device having the same, and method of manufacturing the same | — | 2014-09-02 |
| 8664757 | High density chip stacked package, package-on-package and method of fabricating the same | Kun-dae Yeom | 2014-03-04 |
| 8491982 | Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same | Eunchul Ahn, Taesung Yoon, Youngmin Lee | 2013-07-23 |
| 8232631 | Semiconductor packing having offset stack structure | — | 2012-07-31 |
| 8143710 | Wafer-level chip-on-chip package, package on package, and methods of manufacturing the same | — | 2012-03-27 |