Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051680 | Semiconductor package aligning interposer and substrate | Tae Hwan Kim, Young-Ja Kim, Kang Gyune Lee, Sang Won Lee, Yong Kwan Lee | 2024-07-30 |
| 11862570 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Min-Keun Kwak, Hyun Ki Kim, Yong Kwan Lee | 2024-01-02 |
| 11450614 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Min-Keun Kwak, Hyun Ki Kim, Yong Kwan Lee | 2022-09-20 |
| 10643958 | Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device | Sun-dae Kim, Yun-Rae Cho, Nam-Gyu Baek | 2020-05-05 |
| 10490514 | Semiconductor devices | Nam-Gyu Baek, Yun-Rae Cho, Sun-dae Kim | 2019-11-26 |
| 10304781 | Semiconductor devices including guard ring and crack sensing circuit | Nam-Gyu Baek, Yun-Rae Cho, Sun-dae Kim | 2019-05-28 |
| 10103109 | Semiconductor device, semiconductor chip and method of manufacturing the semiconductor device | Sun-dae Kim, Yun-Rae Cho, Nam-Gyu Baek | 2018-10-16 |
| 10008462 | Semiconductor package | Sun-kyoung Seo, Tae-Je Cho, Yong-Hwan Kwon, Hyun-Soo Chung, Seung-Kwan Ryu +1 more | 2018-06-26 |
| 9984945 | Semiconductor chip | Yun-Rae Cho, Sun-dae Kim, Nam-Gyu Baek | 2018-05-29 |
| 9775230 | Printed circuit board and semiconductor packages including the same | Young Jae Kim, Baik Woo Lee | 2017-09-26 |
| 8640879 | Inclined chute sorter | Brian L. Riise, Ronald C. Rau, Pedro Alejandro Perez-Rodriguez, Scott A. Farling | 2014-02-04 |
| 8633256 | Control of the melt flow rate of polyolefin mixtures recovered from post-consumer durable goods | Brian L. Riise | 2014-01-21 |
| 8056728 | Methods, systems, and devices for separating materials using magnetic and frictional properties | Brian L. Riise, Ron C. Rau, Pedro Alejandro Perez-Rodriguez | 2011-11-15 |
| 7880291 | Integrated circuit package and integrated circuit module | Sang Wook Park, Joong-Hyun Baek | 2011-02-01 |
| 7812445 | Semiconductor memory module having an oblique memory chip | Joong-Hyun Baek, Sun-Won Kang, Moon Jung Kim, Hee Jin Lee | 2010-10-12 |
| 7649248 | Stack package implementing conductive support | — | 2010-01-19 |
| 7642636 | Stack package of ball grid array type | Sang Wook Park | 2010-01-05 |