Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9023639 | Apparatus for amplifying nucleic acids | Jae Young Kim | 2015-05-05 |
| 8796835 | Package on package having improved thermal characteristics | Yoon-Hoon Kim, Eun-Seok Cho | 2014-08-05 |
| 8791580 | Integrated circuit packages having redistribution structures | Chul-Woo Park, Sun-Won Kang, Kil-Soo Kim | 2014-07-29 |
| 8524539 | Method of manufacturing semiconductor package | Hee Jin Lee | 2013-09-03 |
| 8456000 | Semiconductor module and an electronic system including the same | — | 2013-06-04 |
| 8344601 | Light emitting device | Hee Jin Lee | 2013-01-01 |
| 8310046 | Wafer stacked package waving bertical heat emission path and method of fabricating the same | Hee Jin Lee | 2012-11-13 |
| 8184439 | Semiconductor module | Hee Jin Lee, Jin-Kwon Bae | 2012-05-22 |
| 8049329 | Wafer stacked package waving bertical heat emission path and method of fabricating the same | Hee Jin Lee | 2011-11-01 |
| 7880291 | Integrated circuit package and integrated circuit module | Sang Wook Park, Hyung-Gil Baek | 2011-02-01 |
| 7812445 | Semiconductor memory module having an oblique memory chip | Sun-Won Kang, Moon Jung Kim, Hyung-Gil Baek, Hee Jin Lee | 2010-10-12 |
| 7800138 | Semiconductor device including thermally dissipating dummy pads | Sung-jun Im | 2010-09-21 |
| 7705449 | Cooling apparatus for memory module | Yong Hyun Kim, Kwang-Ho Chun, Chang-Yong Park, Hae-Hyung Lee, Hee Jin Lee | 2010-04-27 |
| 7626261 | Wafer stacked package having vertical heat emission path and method of fabricating the same | Hee Jin Lee | 2009-12-01 |
| 7485006 | Memory module, socket and mounting method providing improved heat dissipating characteristics | Sang Wook Park, Hae-Hyung Lee, Hee-Kook Choi, Jin-Yang Lee | 2009-02-03 |
| 7473993 | Semiconductor stack package and memory module with improved heat dissipation | Sang Wook Park, Hae-Hyung Lee | 2009-01-06 |
| 7345882 | Semiconductor module with heat sink and method thereof | Hae-Hyung Lee, Sang Wook Park, Jin-Yang Lee | 2008-03-18 |
| 7301233 | Semiconductor chip package with thermoelectric cooler | Hae-Hyung Lee, Sang Wook Park, Dong-Ho Lee, Jin-Yang Lee | 2007-11-27 |
| 7081375 | Semiconductor package having thermal interface material (TIM) | Ho-Jeong Moon, Dong-Kil Shin, Yun-Hyeok Im | 2006-07-25 |
| 7050303 | Semiconductor module with vertically mounted semiconductor chip packages | Sang Wook Park | 2006-05-23 |
| 6895666 | Underfill system for semiconductor package | Seong Jae Hong | 2005-05-24 |
| 6835598 | Stacked semiconductor module and method of manufacturing the same | Jin-Yang Lee, Yun-Hyeok Im, Tae-koo Lee | 2004-12-28 |
| 6781849 | Multi-chip package having improved heat spread characteristics and method for manufacturing the same | Tae-koo Lee, Min-ha Kim, Yun-Hyeok Im | 2004-08-24 |
| 6756668 | Semiconductor package having thermal interface material (TIM) | Ho-Jeong Moon, Dong-Kil Shin, Yun-Hyeok Im | 2004-06-29 |
| 6498388 | Semiconductor module with improved solder joint reliability | Min-ha Kim | 2002-12-24 |