Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10552022 | Display control method, apparatus, and non-transitory computer-readable recording medium | Hyo Gun Lee, Jong Ju LEE, Won Kyoung Lee, Hee Min Lee, Jong Hyun Lee +5 more | 2020-02-04 |
| 10393646 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Chul Keun Yoon, Min-Kyu Kang, Gyu Jei LEE | 2019-08-27 |
| 9945772 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Chul Keun Yoon, Min-Kyu Kang, Gyu Jei LEE | 2018-04-17 |
| 8922012 | Integrated circuit chip and flip chip package having the integrated circuit chip | Jin-Woo Park, Eun-Chul Ahn, Sun-Won Kang, Jong Ho Lee | 2014-12-30 |
| 8427841 | Electronic device | Shle-Ge Lee | 2013-04-23 |
| 8175652 | Terminal and method of controlling the same | — | 2012-05-08 |
| 8120176 | Semiconductor device having a conductive bump | Shle-Ge Lee, Jong-Joo Lee, Jong Ho Lee | 2012-02-21 |
| 7081375 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Ho-Jeong Moon, Yun-Hyeok Im | 2006-07-25 |
| 6963033 | Ball grid array attaching means having improved reliability and method of manufacturing same | Sang-Young Kim, Ho-Jeong Moon, Seung-Kon Mok | 2005-11-08 |
| 6756668 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Ho-Jeong Moon, Yun-Hyeok Im | 2004-06-29 |
| 6638638 | Hollow solder structure having improved reliability and method of manufacturing same | Sang-Young Kim, Ho-Jeong Moon, Seung-Kon Mok | 2003-10-28 |