Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261135 | Semiconductor packages including antenna pattern | Se-Ho You, Hyeong-Seob Kim | 2025-03-25 |
| 11626373 | Semiconductor packages including antenna pattern | Se-Ho You, Hyeong-Seob Kim | 2023-04-11 |
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Gun Lee, Ji Hwan Hwang, Cha-Jea Jo, Dong-Han Kim | 2019-11-19 |
| 9793309 | Image sensor package | Byoung-Rim Seo, Yoon Young CHOI, Kyoung-Sei Choi, Chang-soo Jin, Tae-weon Suh +1 more | 2017-10-17 |
| 9190401 | Stacked semiconductor packages | Choong Bin Yim, Jin-Woo Park, Dae-Young Choi, Mi-Yeon Kim | 2015-11-17 |
| 8803301 | Semiconductor package | Kyong-Soon Cho, Kwan-Jai Lee, Jae-Min Jung | 2014-08-12 |
| 8759959 | Stacked semiconductor packages | Choong Bin Yim, Jin-Woo Park, Dae-Young Choi, Mi-Yeon Kim | 2014-06-24 |
| 7952199 | Circuit board including solder ball land having hole and semiconductor package having the circuit board | Sang-Gui Jo, Han Shin Youn | 2011-05-31 |
| 7667325 | Circuit board including solder ball land having hole and semiconductor package having the circuit board | Sang-Gui Jo, Han Shin Youn | 2010-02-23 |
| 7579583 | Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same | Young-Hoon Ro | 2009-08-25 |
| 6963033 | Ball grid array attaching means having improved reliability and method of manufacturing same | Sang-Young Kim, Ho-Jeong Moon, Dong-Kil Shin | 2005-11-08 |
| 6638638 | Hollow solder structure having improved reliability and method of manufacturing same | Sang-Young Kim, Ho-Jeong Moon, Dong-Kil Shin | 2003-10-28 |
| 5965947 | Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads | Shi-baek Nam, Dae-Hoon Kwon | 1999-10-12 |
| 5677569 | Semiconductor multi-package stack | Ki-Won Choi, Seung Ho Ahn | 1997-10-14 |
| 5621242 | Semiconductor package having support film formed on inner leads | Seung Ho Ahn, Gu-Sung Kim | 1997-04-15 |
| 5504373 | Semiconductor memory module | Sang E. Oh, Gu-Sung Kim, Seung Ho Ahn | 1996-04-02 |