Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8821826 | Method for regenerating silicon from silicon waste and silicon manufactured using the same | Kun Kul Ryoo, Jae June Kim | 2014-09-02 |
| 8368231 | Chipstack package and manufacturing method thereof | Kang-Wook Lee, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2013-02-05 |
| 8278766 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Young-Hee Song | 2012-10-02 |
| 7977156 | Chipstack package and manufacturing method thereof | Kang-Wook Lee, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2011-07-12 |
| 7824959 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Young-Hee Song | 2010-11-02 |
| 7786594 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Young-Hee Song | 2010-08-31 |
| 7550317 | Method for manufacture of wafer level package with air pads | — | 2009-06-23 |
| 7537959 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2009-05-26 |
| 7534656 | Image sensor device and method of manufacturing the same | Yong-Chai Kwon, Kang-Wook Lee, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang +1 more | 2009-05-19 |
| 7531890 | Multi-chip package (MCP) with a conductive bar and method for manufacturing the same | — | 2009-05-12 |
| 7521657 | Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same | Yong-Chai Kwon, Kang-Wook Lee, Keum-Hee Ma, Seong-Il Han | 2009-04-21 |
| 7375426 | Semiconductor package | Suk-Chae Kang, Si-Hoon Lee, Sa-Yoon Kang, Dong-Han Kim, Yun-Hyeok Im | 2008-05-20 |
| 7371614 | Image sensor device and methods thereof | Yong-Chai Kwon, Suk-Chae Kang, Kang-Wook Lee, Jong Woo Kim, Seong-Il Han +3 more | 2008-05-13 |
| 7307340 | Wafer-level electronic modules with integral connector contacts | Seung-Duk Baek, Dong-Hyeon Jang, Kang-Wook Lee, Jae-Sik Chung | 2007-12-11 |
| 7300864 | Method for forming solder bump structure | Keum-Hee Ma, Se-Young Jeong, Dong-Hyeon Jang | 2007-11-27 |
| 7276799 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2007-10-02 |
| 7262475 | Image sensor device and method of manufacturing same | Yong-Chai Kwon, Kang-Wook Lee, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang +1 more | 2007-08-28 |
| 7224055 | Center pad type IC chip with jumpers, method of processing the same and multi chip package | Dong-Hyeon Jang | 2007-05-29 |
| 7215033 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Young-Hee Song | 2007-05-08 |
| 7196000 | Method for manufacturing a wafer level chip scale package | Jin Hyuk Lee, Dong-Ho Lee, Dong-Hyeon Jang | 2007-03-27 |
| 7141885 | Wafer level package with air pads and manufacturing method thereof | — | 2006-11-28 |
| 6908785 | Multi-chip package (MCP) with a conductive bar and method for manufacturing the same | — | 2005-06-21 |
| 6836018 | Wafer level package and method for manufacturing the same | Dong-Hyeon Jang, Min Young Son, Sa-Yoon Kang | 2004-12-28 |
| 6607938 | Wafer level stack chip package and method for manufacturing same | Yong-Hwan Kwon, Sa-Yoon Kang, Dong-Hyeon Jang, Min Kyo Cho | 2003-08-19 |
| 6586275 | Wafer level package and method for manufacturing the same | Dong-Hyeon Jang, Min Young Son, Sa-Yoon Kang | 2003-07-01 |