Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522522 | Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same | Hyouk Lee, Ki Hong Song, Jun Hee Jeong, Sung Sik Yun | 2019-12-31 |
| 10474192 | Wearable smart device having flexible semiconductor package mounted on a band | Hyouk Lee, Ki Hong Song, Jun Hee Jeong, Sung Sik Yun | 2019-11-12 |
| 9099332 | Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package | Kyung Mi Moon, Ill-heung Choi, Jeong-wook Lee, Young Jin Lee | 2015-08-04 |
| 9028082 | Light source module and illumination apparatus having the same | Cheol Jun Yoo | 2015-05-12 |
| 8987022 | Light-emitting device package and method of manufacturing the same | Cheol Jun Yoo, Seong-Deok Hwang, Sang Hyun Lee | 2015-03-24 |
| 8952404 | Light-emitting device package and method of manufacturing the light-emitting device package | Cheol Jun Yoo | 2015-02-10 |
| 8933474 | Light emitting diode package and manufacturing method thereof | Cheol Jun Yoo | 2015-01-13 |
| 8928154 | Semiconductor module | Sun-Won Kang, Tae-Gyeong Chung, Nam-Seog Kim, Seung-Duk Baek | 2015-01-06 |
| 8894240 | Illumination device | Cheol Jun Yoo | 2014-11-25 |
| 8860069 | Light-emitting device package having a molding member with a low profile, and method of manufacturing the same | Cheol Jun Yoo | 2014-10-14 |
| 8841693 | Light emitting device package and manufacturing method thereof | Jae Sung You | 2014-09-23 |
| 8840265 | Illumination apparatus employing light-emitting device package | Kyung Mi Moon, Ill-heung Choi, Jeong-wook Lee, Young Jin Lee | 2014-09-23 |
| 8722435 | Light emitting device package and method of manufacturing the same | Cheol Jun Yoo, Seong-Deok Hwang, Sang Hyun Lee | 2014-05-13 |
| 8710513 | Light-emitting device package and method of manufacturing the same | Cheol Jun Yoo | 2014-04-29 |
| 8679872 | Light emitting device package and manufacturing method thereof | Cheol Jun Yoo, Seong-Deok Hwang, Sang Hyun Lee | 2014-03-25 |
| 8638037 | Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package | Kyung Mi Moon, Ill-heung Choi, Jeong-wook Lee, Young Jin Lee | 2014-01-28 |
| 8587010 | Light emitting device package and method of manufacturing the same | Cheol Jun Yoo, Seong-Deok Hwang, Sang Hyun Lee | 2013-11-19 |
| 8455889 | Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module | Young Jin Lee, Jeong-wook Lee, Kyung Mi Moon, Ill-heung Choi | 2013-06-04 |
| 8278766 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Gu-Sung Kim | 2012-10-02 |
| 8115324 | Semiconductor module | Sun-Won Kang, Tae-Gyeong Chung, Nam-Seog Kim, Seung-Duk Baek | 2012-02-14 |
| 8116088 | Semiconductor package and method of forming the same, and printed circuit board | Mu-Seob Shin, Min Young Son, Tae-Sung Yoon, Byung-Seo Kim | 2012-02-14 |
| 7825523 | Semiconductor chip having bond pads | Il-Heung Choi, Jeong-Jin Kim, Hae-Jeong Sohn, Chung Woo Lee | 2010-11-02 |
| 7824959 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Gu-Sung Kim | 2010-11-02 |
| 7821127 | Semiconductor device package having buffered memory module and method thereof | Jong-Joo Lee | 2010-10-26 |
| 7786594 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Se-Yong Oh, Gu-Sung Kim | 2010-08-31 |