Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11086345 | Integrated circuit with adaptability to a process-voltage-temperature (PVT) variation | Seok-Won Lee | 2021-08-10 |
| 10747250 | Integrated circuit with adaptability to a process-voltage-temperature (PVT) variation | Seok-Won Lee | 2020-08-18 |
| 10715159 | Wide-range local oscillator (LO) generators and apparatuses including the same | Sang Soo Ko, Byoung-joong Kang | 2020-07-14 |
| 10547315 | Frequency divider and a transceiver including the same | Jae Won Choi | 2020-01-28 |
| 10326460 | Wide-range local oscillator (LO) generators and apparatuses including the same | Sang Soo Ko, Byoung-joong Kang | 2019-06-18 |
| 10122378 | Digital-to-time converter and operating method thereof | — | 2018-11-06 |
| 9245827 | 3D semiconductor device | Uk-Song Kang, Dong-Hyeon Jang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim +2 more | 2016-01-26 |
| 8928154 | Semiconductor module | Sun-Won Kang, Young-Hee Song, Tae-Gyeong Chung, Seung-Duk Baek | 2015-01-06 |
| 8779576 | Wafer level package and methods of fabricating the same | Sang Wook Park, Seung-Duk Baek | 2014-07-15 |
| 8743582 | 3D semiconductor device | Uk-Song Kang, Dong-Hyeon Jang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim +2 more | 2014-06-03 |
| 8431479 | Semiconductor devices having redistribution structures and packages, and methods of forming the same | Ki Hyuk Kim, Hyun-Soo Chung, Seok Ho Kim, Myeong-Soon Park, Chang-Woo Shin | 2013-04-30 |
| 8373261 | Chip stack package and method of fabricating the same | Pyoung-Wan Kim, Min-Seung Yoon, Keum-Hee Ma | 2013-02-12 |
| 8362621 | Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same | Ho-Jin Lee, Dong-Hyeon Jang, In-Young Lee, Ha Young Yim | 2013-01-29 |
| 8114772 | Method of manufacturing the semiconductor device | Kyu-Ha Lee, Min-Seung Yoon, Ui-Hyoung Lee, Ju-II Choi, Keum-Hee Ma | 2012-02-14 |
| 8115324 | Semiconductor module | Sun-Won Kang, Young-Hee Song, Tae-Gyeong Chung, Seung-Duk Baek | 2012-02-14 |
| 8088648 | Method of manufacturing a chip stack package | Cha-Jea Jo, Myung-Kee Chung, In-Young Lee, Seok Ho Kim, Ho-Jin Lee +2 more | 2012-01-03 |
| 7948089 | Chip stack package and method of fabricating the same | Hyun-Soo Chung, Dong-Ho Lee, Son-Kwan Hwang | 2011-05-24 |
| 7923291 | Method of fabricating electronic device having stacked chips | Hae-Jung Yu, Eun-Chul Ahn, Tae-Gyeong Chung | 2011-04-12 |
| 7830017 | Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package | In-Young Lee, Dong-Ho Lee, Hyun-Soo Chung, Ho-Jin Lee, Myeong-Soo Park | 2010-11-09 |
| 7825710 | Delay-locked loop circuits and method for generating transmission core clock signals | Uk-Rae Cho | 2010-11-02 |
| 7807512 | Semiconductor packages and methods of fabricating the same | Teak-Hoon Lee, Pyoung-Wan Kim, Chul-Yong Jang | 2010-10-05 |
| 7777345 | Semiconductor device having through electrode and method of fabricating the same | Ho-Jin Lee, Yong-Chai Kwon, Hyun-Soo Chung, In-Young Lee, Son-Kwan Hwang | 2010-08-17 |
| 7697314 | Data line layout and line driving method in semiconductor memory device | Hak-Soo Yu, Uk-Rae Cho | 2010-04-13 |
| 7656723 | Semiconductor memory device with hierarchical bit line structure | Jong-Cheol Lee, Hak-Soo Yu, Uk-Rae Cho | 2010-02-02 |
| 7638365 | Stacked chip package and method for forming the same | Se-Young Jeong, Cha-Jea Jo, Jong Ho Lee, Myeong-Soon Park | 2009-12-29 |