Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237309 | Semiconductor package having pads with stepped structure | Hyun-Soo Chung, Tae Won Yoo | 2025-02-25 |
| 11955464 | Semiconductor package having pads with stepped structure | Hyun-Soo Chung, Tae Won Yoo | 2024-04-09 |
| 11574892 | Semiconductor package having pads with stepped structure | Hyun-Soo Chung, Tae Won Yoo | 2023-02-07 |
| 10872802 | Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same | Gun-ho Chang | 2020-12-22 |
| 9041181 | Land grid array package capable of decreasing a height difference between a land and a solder resist | Hee Chul Lee, Kun-dae Yeom | 2015-05-26 |
| 8088648 | Method of manufacturing a chip stack package | Cha-Jea Jo, Nam-Seog Kim, In-Young Lee, Seok Ho Kim, Ho-Jin Lee +2 more | 2012-01-03 |
| 7807507 | Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package | Won Keun Kim, Myung-Sung Kang | 2010-10-05 |
| 7588964 | Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same | Yong-Chai Kwon, Dong-Ho Lee, Kang-Wook Lee, Sun-Won Kang, Keum-Hee Ma | 2009-09-15 |
| 7064435 | Semiconductor package with improved ball land structure | Min-Keun Kwak, Kil-Soo Kim | 2006-06-20 |
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Sa-Yoon Kang, In-Ku Kang, Kwan-Jai Lee | 2002-09-10 |
| 6348363 | Method for manufacturing a semiconductor package | Hee-Kook Choi, San Yeop Lee | 2002-02-19 |
| 6245490 | Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same | Jin H. Yoon, Gi Bum Park, In Pyo Hong, Yong-Don Kim | 2001-06-12 |
| 6207478 | Method for manufacturing semiconductor package of center pad type device | Jin Soon Lee, Ho Jin, In Pyo Hong | 2001-03-27 |
| 6041495 | Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same | Jin H. Yoon, Gi Bum Park, In Pyo Hong, Yong-Don Kim | 2000-03-28 |