Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183653 | Thermal conductive film | Joungphil Lee, Yeongseok Kim, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2024-12-31 |
| 11656148 | Elastic material vibration test apparatus | Byungguk LIM, Chang-Hoon Lee, Ji Young Yeom | 2023-05-23 |
| 11355413 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | Joungphil Lee, Yeongseok Kim, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2022-06-07 |
| 10923465 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Won-Gi Chang, Dongwon Lee, Hyein Yoo | 2021-02-16 |
| 10910339 | Flip chip bonding method | Hwail Jin, Yongwon Choi, Yeongseok Kim, Wonkeun Kim | 2021-02-02 |
| 10446525 | Semiconductor package | Yong Won Choi, Won Keun Kim, Gwang-sun Seo | 2019-10-15 |
| 10354985 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Won-Gi Chang, Dongwon Lee, Hyein Yoo | 2019-07-16 |
| 10043780 | Semiconductor package | Yong Won Choi, Won Keun Kim, Gwang-sun Seo | 2018-08-07 |
| 9991234 | Semiconductor package | Gwang-sun Seo, Won Keun Kim, Jin-Woo Park, Yong Won Choi | 2018-06-05 |
| 8958011 | Bi-directional camera module and flip chip bonder including the same | Sang-Sick Park, Ji-Seok Hong | 2015-02-17 |
| 7807507 | Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package | Won Keun Kim, Myung-Kee Chung | 2010-10-05 |