Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183653 | Thermal conductive film | Joungphil Lee, Myung-Sung Kang, Yeongseok Kim, Gwangsun Seo, Yongwon Choi | 2024-12-31 |
| 11355413 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | Joungphil Lee, Myung-Sung Kang, Yeongseok Kim, Gwangsun Seo, Yongwon Choi | 2022-06-07 |
| 10923465 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Won-Gi Chang, Dongwon Lee, Myung-Sung Kang | 2021-02-16 |
| 10354985 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Won-Gi Chang, Dongwon Lee, Myung-Sung Kang | 2019-07-16 |
| 10147713 | Semiconductor package having mold layer with curved corner and method of fabricating same | Yeongseok Kim | 2018-12-04 |
| 10115613 | Method of fabricating a fan-out panel level package and a carrier tape film therefor | Won-Gi Chang, Yeongseok Kim | 2018-10-30 |
| 9929131 | Method of fabricating a semiconductor package having mold layer with curved corner | Yeongseok Kim | 2018-03-27 |
| 9842962 | Nanostructured hybrid particle, manufacturing method thereof, and device including the nanostructured hybrid particle | Kyoungja Woo | 2017-12-12 |