Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374575 | Debonding tape and method of processing semiconductor wafer using the same | Seonho Lee | 2025-07-29 |
| 12183653 | Thermal conductive film | Joungphil Lee, Myung-Sung Kang, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2024-12-31 |
| 12062633 | Non-conductive film sheet and semiconductor package including the same | Joungphil Lee | 2024-08-13 |
| 12057425 | Semiconductor package | Eunyeong Kim, Jihwan Hwang | 2024-08-06 |
| 12040213 | Processing tape and method of fabricating a semiconductor device using the same | Hwail Jin, Seon Ho Lee | 2024-07-16 |
| 11455980 | Vehicle and controlling method of vehicle | Jung Keun You, MunHwan Cho, Joongkwan Kim, Myoungok Lee, Kaangdok Yee +1 more | 2022-09-27 |
| 11355413 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | Joungphil Lee, Myung-Sung Kang, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2022-06-07 |
| 10910339 | Flip chip bonding method | Hwail Jin, Yongwon Choi, Myung-Sung Kang, Wonkeun Kim | 2021-02-02 |
| 10551548 | Backlight unit and display apparatus including the same | Kwangkeun Lee, Youngmin Kim, Haeil Park, Seon-Tae Yoon, Junhan Lee | 2020-02-04 |
| 10553546 | Semiconductor package and semiconductor module | Joungphil Lee | 2020-02-04 |
| 10297554 | Semiconductor package and method of fabricating the same | — | 2019-05-21 |
| 10211163 | Semiconductor package and method of fabricating the same | — | 2019-02-19 |
| 10147713 | Semiconductor package having mold layer with curved corner and method of fabricating same | Hyein Yoo | 2018-12-04 |
| 10115613 | Method of fabricating a fan-out panel level package and a carrier tape film therefor | Won-Gi Chang, Hyein Yoo | 2018-10-30 |
| 9929131 | Method of fabricating a semiconductor package having mold layer with curved corner | Hyein Yoo | 2018-03-27 |
| 9922935 | Semiconductor package and method of fabricating the same | — | 2018-03-20 |
| 9418943 | Semiconductor package and method of manufacturing the same | — | 2016-08-16 |