Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183653 | Thermal conductive film | Myung-Sung Kang, Yeongseok Kim, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2024-12-31 |
| 12062633 | Non-conductive film sheet and semiconductor package including the same | Yeongseok Kim | 2024-08-13 |
| 11876031 | Thermal interface material paste and semiconductor package | Wonkeun Kim, Mihyae PARK | 2024-01-16 |
| 11355413 | Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same | Myung-Sung Kang, Yeongseok Kim, Gwangsun Seo, Hyein Yoo, Yongwon Choi | 2022-06-07 |
| 10553546 | Semiconductor package and semiconductor module | Yeongseok Kim | 2020-02-04 |
| 10433469 | Semiconductor package and semiconductor module | — | 2019-10-01 |