Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876031 | Thermal interface material paste and semiconductor package | Joungphil Lee, Wonkeun Kim | 2024-01-16 |
MP
Mihyae PARK
Overall (All Time): #2,470,814 of 4,157,543Top 60%
1
Patents All Time