Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057425 | Semiconductor package | Eunyeong Kim, Yeongseok Kim | 2024-08-06 |
| 12040313 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Taehun Kim +1 more | 2024-07-16 |
| 11955449 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Sang Cheon Park | 2024-04-09 |
| 11791308 | Semiconductor package | Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2023-10-17 |
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee, Jiseok Hong | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong +1 more | 2023-08-08 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Jiseok Hong, Hyuekjae Lee, Jongpa HONG, Taehun Kim | 2023-06-13 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Taehun Kim +1 more | 2023-05-23 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2023-05-23 |
| 11508685 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Sang Cheon Park | 2022-11-22 |
| 11404395 | Semiconductor package including underfill material layer and method of forming the same | Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee, Jiseok Hong | 2022-08-02 |
| 11362062 | Semiconductor package | Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2022-06-14 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park +1 more | 2022-03-29 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Jiseok Hong +1 more | 2022-02-08 |
| 11158594 | Semiconductor packages having improved reliability in bonds between connection conductors and pads | Jiseok Hong, Hyuekjae Lee, Jongpa HONG, Taehun Kim | 2021-10-26 |
| 10651154 | Semiconductor packages | Sang-Sick Park, Geol Nam, Tae Hong Min | 2020-05-12 |
| 10090278 | Semiconductor packages | Sang-Sick Park, Geol Nam, Tae Hong Min | 2018-10-02 |
| 9589947 | Semiconductor packages and methods of manufacturing the same | Young Kun Jee, Jung-Hwan Kim, Tae Hong Min, Kwang-chul Choi | 2017-03-07 |