Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400990 | Semiconductor package | Sechul Park, Heewon KIM, Jongho Park, Hyojin Yun, Juil Choi | 2025-08-26 |
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Myungsung Kang, Jaekyung Yoo, Chungsun Lee | 2025-08-19 |
| 12355004 | Semiconductor chip and semiconductor package | Junyeong Heo, Yeongkwon Ko, Teakhoon Lee | 2025-07-08 |
| 12218102 | Semiconductor package | Youngkun JEE, Sanghoon Lee, Chungsun Lee | 2025-02-04 |
| 12218086 | Semiconductor package and method of manufacturing same | Yongbum Kwon | 2025-02-04 |
| 12218096 | Semiconductor package and method of forming the same | Yeongkwon Ko, Soyeon Kwon, Yoonsung Kim, Teakhoon Lee | 2025-02-04 |
| 12199056 | Semiconductor device, semiconductor package and method of manufacturing the same | Jumyong Park, Byeongchan KIM, Solji Song, Chungsun Lee | 2025-01-14 |
| 12176313 | Semiconductor package | Hyoungjoo Lee, Sechul Park, Sangsick Park, Hyojin Yun, Teakhoon Lee +1 more | 2024-12-24 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Jeonggi Jin, Gyuho Kang, Heewon KIM, Jumyong Park, Hyunsu Hwang | 2024-07-02 |
| 11967581 | Package structures having underfills | Jinwoo Park, Jongho Lee, Teakhoon Lee | 2024-04-23 |
| 11935832 | Semiconductor device and method of fabricating the same | Junyeong Heo, Donghoon Won | 2024-03-19 |
| 11791308 | Semiconductor package | Jihwan Hwang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2023-10-17 |
| 11705323 | Wafer trimming device | Jungseok Ahn, Chungsun Lee, Teakhoon Lee | 2023-07-18 |
| 11688707 | Semiconductor package | Joonho Jun, Sangsick Park | 2023-06-27 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2023-05-23 |
| 11587906 | Package structures having underfills | Jinwoo Park, Jongho Lee, Teakhoon Lee | 2023-02-21 |
| 11569145 | Semiconductor package with thermal interface material for improving package reliability | Sanghyun Lee, Juhyun Lyu, Chulwoo Kim, Jongho Lee | 2023-01-31 |
| 11469180 | Semiconductor device including an insulating material layer with concave-convex portions | Junyeong Heo, Donghoon Won | 2022-10-11 |
| 11362062 | Semiconductor package | Jihwan Hwang, Sangsick Park, Jihwan Suh, Soyoun Lee, Teakhoon Lee | 2022-06-14 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2022-03-29 |