Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Myungsung Kang, Unbyoung Kang, Chungsun Lee | 2025-08-19 |
| 12362328 | Semiconductor package and method of fabricating the same | Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2025-07-15 |
| 12165991 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Teak-Hoon Lee | 2024-12-10 |
| 12062639 | Semiconductor package and method of fabricating the same | Jongho Lee, Yeongkwon Ko | 2024-08-13 |
| 11923340 | Semiconductor package including mold layer and manufacturing method thereof | Yeongkwon Ko, Jinwoo Park, Teakhoon Lee | 2024-03-05 |
| 11923343 | Semiconductor package and method of fabricating the same | Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Yeongkwon Ko, Jayeon LEE, Jaeeun Lee, Teakhoon Lee | 2023-10-17 |
| 11594499 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Teak-Hoon Lee | 2023-02-28 |
| 11538792 | Semiconductor package and method of fabricating the same | Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2022-12-27 |
| 11462462 | Semiconductor packages including a recessed conductive post | Jaeeun Lee, Yeongkwon Ko, Teakhoon Lee | 2022-10-04 |