Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394641 | Molding apparatus of semiconductor package | Jinwoo Park, Jaekyung Yoo, Unbyoung Kang, Chungsun Lee | 2025-08-19 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2023-05-23 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2022-03-29 |