Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327784 | Semiconductor package | Heonwoo Kim, Sungwoo Park, Chajea Jo | 2025-06-10 |
| 12266638 | Semiconductor package | Youngmin Lee | 2025-04-01 |
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Jinkyeong Seol +1 more | 2024-10-29 |
| 12094867 | Semiconductor package | Youngmin Lee | 2024-09-17 |
| 12080691 | Semiconductor devices | Sungwoo Park, Heonwoo Kim, Wonil Lee | 2024-09-03 |
| 11824045 | Semiconductor package and method of manufacturing the semiconductor package | Junghwan Kim | 2023-11-21 |
| 11749662 | Semiconductor package | Youngmin Lee | 2023-09-05 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Hyuekjae Lee +1 more | 2023-05-23 |
| 11621247 | Semiconductor package | Youngmin Lee | 2023-04-04 |
| 11552033 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Jinkyeong Seol +1 more | 2023-01-10 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Jiseok Hong, Unbyoung Kang, Myungsung Kang, Taehun Kim, Hyuekjae Lee +1 more | 2022-03-29 |