| 12400980 |
Semiconductor package |
Sunkyoung Seo, Teak-Hoon Lee |
2025-08-26 |
| 12327784 |
Semiconductor package |
Sangcheon Park, Heonwoo Kim, Sungwoo Park |
2025-06-10 |
| 11990452 |
Semiconductor package |
Namhoon Kim, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon |
2024-05-21 |
| 11942446 |
Semiconductor package and method of manufacturing the same |
Hyoeun Kim, Sunkyoung Seo, Seunghoon Yeon |
2024-03-26 |
| 11923342 |
Semiconductor package |
Sanguk Han, Hyoeun Kim, Sunkyoung Seo |
2024-03-05 |
| 11887913 |
Integrated circuit device and semiconductor package including the same |
Ohguk KWON, Namhoon Kim, Hyoeun Kim, Seunghoon Yeon |
2024-01-30 |
| 11848293 |
Semiconductor package |
Sunkyoung Seo, Teak-Hoon Lee |
2023-12-19 |
| 11824076 |
Semiconductor package including an image sensor chip and a method of fabricating the same |
Yonghoe Cho, Chungsun Lee, Yoonha Jung |
2023-11-21 |
| 11776941 |
Semiconductor package |
Yonghoe Cho, Sunkyoung Seo |
2023-10-03 |
| 11626385 |
Semiconductor package |
Namhoon Kim, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon |
2023-04-11 |
| 11600608 |
Semiconductor package |
Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park |
2023-03-07 |
| 11569201 |
Semiconductor package and method of fabricating the same |
Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Sang-Uk Han |
2023-01-31 |
| 11545512 |
Image sensor package with underfill and image sensor module including the same |
Ohguk KWON, Hyoeun Kim, Seunghoon Yeon |
2023-01-03 |
| 11545417 |
Integrated circuit device and semiconductor package including the same |
Ohguk KWON, Namhoon Kim, Hyoeun Kim, Seunghoon Yeon |
2023-01-03 |
| 11444060 |
Semiconductor package |
Sanguk Han, Hyoeun Kim, Sunkyoung Seo |
2022-09-13 |
| 11335719 |
Semiconductor package including an image sensor chip and a method of fabricating the same |
Yonghoe Cho, Chungsun Lee, Yoonha Jung |
2022-05-17 |
| 11158603 |
Semiconductor package and method of fabricating the same |
Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Sang-Uk Han |
2021-10-26 |
| 11152416 |
Semiconductor package including a redistribution line |
Ji Hwang Kim, Hyoeun Kim, Jongbo Shim, Sang-Uk Han |
2021-10-19 |
| 10985152 |
Semiconductor package |
Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park |
2021-04-20 |
| 10978431 |
Semiconductor package with connection substrate and method of manufacturing the same |
Jongbo Shim, Ji Hwang Kim, Sang-Uk Han |
2021-04-13 |
| 10734367 |
Semiconductor package and method of fabricating the same |
Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Taeje Cho |
2020-08-04 |
| 10651224 |
Semiconductor package including a redistribution line |
Ji Hwang Kim, Hyoeun Kim, Jongbo Shim, Sang-Uk Han |
2020-05-12 |
| 10510737 |
Semiconductor package |
Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park |
2019-12-17 |
| 10361170 |
Semiconductor package |
Sungeun Pyo, Jongbo Shim, Ji Hwang Kim, Sang-Uk Han |
2019-07-23 |
| 10192855 |
Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line |
Sunkyoung Seo, Ji Hwang Kim, Taeje Cho |
2019-01-29 |
