Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400980 | Semiconductor package | Sunkyoung Seo, Teak-Hoon Lee | 2025-08-26 |
| 12327784 | Semiconductor package | Sangcheon Park, Heonwoo Kim, Sungwoo Park | 2025-06-10 |
| 11990452 | Semiconductor package | Namhoon Kim, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2024-05-21 |
| 11942446 | Semiconductor package and method of manufacturing the same | Hyoeun Kim, Sunkyoung Seo, Seunghoon Yeon | 2024-03-26 |
| 11923342 | Semiconductor package | Sanguk Han, Hyoeun Kim, Sunkyoung Seo | 2024-03-05 |
| 11887913 | Integrated circuit device and semiconductor package including the same | Ohguk KWON, Namhoon Kim, Hyoeun Kim, Seunghoon Yeon | 2024-01-30 |
| 11848293 | Semiconductor package | Sunkyoung Seo, Teak-Hoon Lee | 2023-12-19 |
| 11824076 | Semiconductor package including an image sensor chip and a method of fabricating the same | Yonghoe Cho, Chungsun Lee, Yoonha Jung | 2023-11-21 |
| 11776941 | Semiconductor package | Yonghoe Cho, Sunkyoung Seo | 2023-10-03 |
| 11626385 | Semiconductor package | Namhoon Kim, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2023-04-11 |
| 11600608 | Semiconductor package | Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2023-03-07 |
| 11569201 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Sang-Uk Han | 2023-01-31 |
| 11545512 | Image sensor package with underfill and image sensor module including the same | Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2023-01-03 |
| 11545417 | Integrated circuit device and semiconductor package including the same | Ohguk KWON, Namhoon Kim, Hyoeun Kim, Seunghoon Yeon | 2023-01-03 |
| 11444060 | Semiconductor package | Sanguk Han, Hyoeun Kim, Sunkyoung Seo | 2022-09-13 |
| 11335719 | Semiconductor package including an image sensor chip and a method of fabricating the same | Yonghoe Cho, Chungsun Lee, Yoonha Jung | 2022-05-17 |
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Sang-Uk Han | 2021-10-26 |
| 11152416 | Semiconductor package including a redistribution line | Ji Hwang Kim, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2021-10-19 |
| 10985152 | Semiconductor package | Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2021-04-20 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Jongbo Shim, Ji Hwang Kim, Sang-Uk Han | 2021-04-13 |
| 10734367 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Yonghwan Kwon, Yun-Seok Choi, Taeje Cho | 2020-08-04 |
| 10651224 | Semiconductor package including a redistribution line | Ji Hwang Kim, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2020-05-12 |
| 10510737 | Semiconductor package | Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2019-12-17 |
| 10361170 | Semiconductor package | Sungeun Pyo, Jongbo Shim, Ji Hwang Kim, Sang-Uk Han | 2019-07-23 |
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Sunkyoung Seo, Ji Hwang Kim, Taeje Cho | 2019-01-29 |