| 12230576 |
Chip-on-film package and display apparatus including the same |
Jaemin Jung, Jeongkyu Ha |
2025-02-18 |
| 12148337 |
Chip on film package with trench to reduce slippage and display device including the same |
Jaemin Jung, Jeongkyu Ha, KwanJai Lee |
2024-11-19 |
| 12087696 |
Semiconductor package |
Sunkyoung Seo, Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee |
2024-09-10 |
| 11923342 |
Semiconductor package |
Chajea Jo, Hyoeun Kim, Sunkyoung Seo |
2024-03-05 |
| 11869818 |
Chip-stacked semiconductor package and method of manufacturing same |
Hyoeun Kim, Yonghoe Cho, Sunkyoung Seo, Seunghoon Yeon |
2024-01-09 |
| 11842945 |
Chip on film package and display apparatus including the same |
Jaemin Jung, Yoonha Jung |
2023-12-12 |
| 11574873 |
Semiconductor package |
Sunkyoung Seo, Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee |
2023-02-07 |
| 11444060 |
Semiconductor package |
Chajea Jo, Hyoeun Kim, Sunkyoung Seo |
2022-09-13 |
| 11328966 |
Chip-stacked semiconductor package and method of manufacturing same |
Hyoeun Kim, Yonghoe Cho, Sunkyoung Seo, Seunghoon Yeon |
2022-05-10 |
