| 12191246 |
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal |
Jae-Min Jung, Jeong-Kyu Ha, Sang-Uk Han |
2025-01-07 |
| 12148337 |
Chip on film package with trench to reduce slippage and display device including the same |
Sanguk Han, Jaemin Jung, Jeongkyu Ha |
2024-11-19 |
| 11830803 |
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal |
Jae-Min Jung, Jeong-Kyu Ha, Sang-Uk Han |
2023-11-28 |
| 9818732 |
Chip-on-film package and device assembly including the same |
Jae-Min Jung, Sang-Uk Han, KyongSoon Cho, Jeong-Kyu Ha |
2017-11-14 |
| 9620389 |
Methods of fabricating tape film packages |
Jeong-Kyu Ha, Youngshin Kwon, Jae-Min Jung, KyongSoon Cho, Sang-Uk Han |
2017-04-11 |
| 9241407 |
Tape film packages and methods of fabricating the same |
Jeong-Kyu Ha, Youngshin Kwon, Jae-Min Jung, KyongSoon Cho, Sang-Uk Han |
2016-01-19 |
| 9177904 |
Chip-on-film package and device assembly including the same |
Jae-Min Jung, Sang-Uk Han, KyongSoon Cho, Jeong-Kyu Ha |
2015-11-03 |
| 8940621 |
Methods of forming semiconductor modules including flexible panels |
Sang-Uk Han, Jeong-Kyu Ha, Youngshin Kwon, Seung Hwan Kim |
2015-01-27 |
