Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12235724 | Method and apparatus for processing transaction | Jong In IM, Joo Kyung Park, Yong Tae Kim | 2025-02-25 |
| 12191246 | Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal | KwanJai Lee, Jae-Min Jung, Jeong-Kyu Ha | 2025-01-07 |
| 12113087 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2024-10-08 |
| 12086106 | Method and apparatus for providing metadata sharing service | Jun Jo, Hyo Jin Kim | 2024-09-10 |
| 11830803 | Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal | KwanJai Lee, Jae-Min Jung, Jeong-Kyu Ha | 2023-11-28 |
| 11764140 | Semiconductor device | Duck Gyu KIM, Min Ki Kim, Jae-Min Jung, Jeong-Kyu Ha | 2023-09-19 |
| 11710757 | Semiconductor package and method of fabricating the same | Ohguk KWON, Hyoeun Kim, Sunkyoung Seo | 2023-07-25 |
| 11637140 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2023-04-25 |
| 11600556 | Semiconductor package | Minki Kim, Duckgyu Kim, Jae-Min Jung, Jeong-Kyu Ha | 2023-03-07 |
| 11600608 | Semiconductor package | Jichul Kim, Chajea Jo, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2023-03-07 |
| 11569201 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo | 2023-01-31 |
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo | 2021-10-26 |
| 11152416 | Semiconductor package including a redistribution line | Ji Hwang Kim, Chajea Jo, Hyoeun Kim, Jongbo Shim | 2021-10-19 |
| 10985152 | Semiconductor package | Jichul Kim, Chajea Jo, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2021-04-20 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Jongbo Shim, Ji Hwang Kim, Chajea Jo | 2021-04-13 |
| 10971535 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2021-04-06 |
| 10750112 | Substrate structures for image sensor modules and image sensor modules including the same | Ji Hwang Kim, Hyo-Eun Kim, Jong Bo Shim, Cha-Jea Jo | 2020-08-18 |
| 10680025 | Semiconductor package and image sensor | Jong Bo Shim, Cha-Jea Jo | 2020-06-09 |
| 10651224 | Semiconductor package including a redistribution line | Ji Hwang Kim, Chajea Jo, Hyoeun Kim, Jongbo Shim | 2020-05-12 |
| 10510737 | Semiconductor package | Jichul Kim, Chajea Jo, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2019-12-17 |
| 10361170 | Semiconductor package | Sungeun Pyo, Jongbo Shim, Ji Hwang Kim, Chajea Jo | 2019-07-23 |
| 10199319 | Printed circuit board and semiconductor package including the same | Jong Bo Shim, Yun-Seok Choi, Ji Hwang Kim | 2019-02-05 |
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Jong Bo Shim, Cha-Jea Jo, Gun-ho Chang | 2018-07-17 |
| 10020290 | Semiconductor device having stacked semiconductor chips interconnected via TSV | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Young Kun Jee | 2018-07-10 |
| 9905550 | Semiconductor package and method of fabricating the same | Seungwon Park, Un-Byoung Kang, Taeje Cho | 2018-02-27 |