| 12302495 |
Interposer structure and an electronic device including the same |
Yeonkyung CHUNG, Jinyong Park, Gyeongmin Jin |
2025-05-13 |
| 12279371 |
Printed circuit board assembly and electronic device comprising same |
Gyeongmin Jin, Yongjae SONG, Jaeyeon Ra, Chagyu SONG |
2025-04-15 |
| 11832389 |
Printed circuit module and electronic device including the same |
Taewon Sun, Kicheol BAE, Jinyong Park, Jungje BANG, Yongjae SONG |
2023-11-28 |
| 11675392 |
Electronic device including rollable display |
Jinyong Park, Dongku Kang, Bongkyu MIN, Baekeun CHO, Chihyun Cho +1 more |
2023-06-13 |
| 11600608 |
Semiconductor package |
Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park |
2023-03-07 |
| 10985152 |
Semiconductor package |
Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park |
2021-04-20 |
| 10937771 |
Semiconductor packages |
Jae Choon Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon |
2021-03-02 |
| 10658266 |
Thermoelectric cooling packages and thermal management methods thereof |
Jae Choon Kim, Jin-Kwon Bae, Eunseok Cho |
2020-05-19 |
| 10510737 |
Semiconductor package |
Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park |
2019-12-17 |
| 10347611 |
Semiconductor packages having redistribution substrate |
Jae Choon Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon |
2019-07-09 |
| 10198049 |
Surface temperature management method of mobile device and memory thermal management method of multichip package |
Heungkyu Kwon, Jae Choon Kim, Eunseok Cho |
2019-02-05 |
| 9978661 |
Packaged semiconductor chips having heat dissipation layers and ground contacts therein |
Yunhyeok Im, Oleg Feygenson, Sang-Il Kim, Youngbae Kim, Seungkon Mok +1 more |
2018-05-22 |
| 9903764 |
Integrated circuit for estimating power of at least one node using temperature and a system including the same |
Kyungsoo Lee, Sridhar Sundaram, Wook Kim, Myungkyoon Yim |
2018-02-27 |
| 9679874 |
Semiconductor package and semiconductor device including the same |
Jin-Kwon Bae, Jae Choon Kim, Kyol Park, Chajea Jo |
2017-06-13 |
| 9671141 |
Thermoelectric cooling packages and thermal management methods thereof |
Jae Choon Kim, Jin-Kwon Bae, Eunseok Cho |
2017-06-06 |
| 9651431 |
Semiconductor package and method of estimating surface temperature of semiconductor device including the same |
Jae Choon Kim, Jin-Kwon Bae, Eunho JUNG |
2017-05-16 |
| 9606591 |
Surface temperature management method of mobile device and memory thermal management method of multichip package |
Heungkyu Kwon, Jae Choon Kim, Eunseok Cho |
2017-03-28 |
| 9583430 |
Package-on-package device |
Kyol Park, Yunhyeok Im, Eon Soo Jang |
2017-02-28 |
| 9391009 |
Semiconductor packages including heat exhaust part |
Eon Soo Jang, Kyol Park, Jongwoo Park, Jin-Kwon Bae, Yunhyeok Im +1 more |
2016-07-12 |
| 9228763 |
Thermoelectric cooling packages and thermal management methods thereof |
Jae Choon Kim, Jin-Kwon Bae, Eunseok Cho |
2016-01-05 |
| 9030826 |
Chip-on-film packages and device assemblies including the same |
Jae Choon Kim, Young-Deuk Kim, Eunseok Cho |
2015-05-12 |
| 9013031 |
Semiconductor packages including heat diffusion vias and interconnection vias |
Yunhyeok Im, Kyol Park, Seongho Shin |
2015-04-21 |
| 8988645 |
Display devices |
Young-Deuk Kim, Eunseok Cho, Mi-Na Choi |
2015-03-24 |
| 8733796 |
Robot cleaner |
Jeihun Lee, Jeongsuk Yoon, Jongwon Park, Yunkeun Kwak, Donghoon Yi +1 more |
2014-05-27 |
