Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742329 | Semiconductor package | Jongho Park, Kyungsuk Oh, Hyunki Kim, Yongkwan Lee, Sangsoo Kim +2 more | 2023-08-29 |
| 11101243 | Semiconductor package | Jongho Park, Kyungsuk Oh, Hyunki Kim, Yongkwan Lee, Sangsoo Kim +2 more | 2021-08-24 |
| 9978661 | Packaged semiconductor chips having heat dissipation layers and ground contacts therein | Yunhyeok Im, Oleg Feygenson, Sang-Il Kim, Youngbae Kim, Jichul Kim +1 more | 2018-05-22 |
| 9640575 | Semiconductor package including image sensor and holder with transparent cover and adhesive stopper | Hansung Ryu | 2017-05-02 |
| 9324748 | Semiconductor package including an image sensor and a holder with stoppers | Hansung Ryu | 2016-04-26 |
| 8569114 | Method of forming a semiconductor device package | Choongbin Yim, Donghan Kim, Jin-Woo Park, PaLan Lee, Mi-Yeon Kim | 2013-10-29 |