Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272610 | Semiconductor package with stiffener | — | 2025-04-08 |
| 11574819 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hyunsoo Chung, Inyoung Lee | 2023-02-07 |
| 10937771 | Semiconductor packages | Jichul Kim, Jae Choon Kim, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2021-03-02 |
| 10937667 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hyunsoo Chung, Inyoung Lee | 2021-03-02 |
| 10699915 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hyunsoo Chung, Inyoung Lee | 2020-06-30 |
| 10347611 | Semiconductor packages having redistribution substrate | Jichul Kim, Jae Choon Kim, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2019-07-09 |
| 10211070 | Semiconductor device and method for manufacturing the same | Chanho Lee, Hyunsoo Chung, Inyoung Lee | 2019-02-19 |
| 9978694 | Semiconductor package and method of fabricating the same | KyongSoon Cho, Myoungkyun Kil | 2018-05-22 |
| 9640575 | Semiconductor package including image sensor and holder with transparent cover and adhesive stopper | Seungkon Mok | 2017-05-02 |
| 9324748 | Semiconductor package including an image sensor and a holder with stoppers | Seungkon Mok | 2016-04-26 |