Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862589 | Wafer-level package including under bump metal layer | Hyung-Sun Jang | 2024-01-02 |
| 11810878 | Wafer-level package including under bump metal layer | Hyung-Sun Jang | 2023-11-07 |
| 11107783 | Wafer-level package including under bump metal layer | Hyung-Sun Jang | 2021-08-31 |
| 10937771 | Semiconductor packages | Jichul Kim, Jae Choon Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho | 2021-03-02 |
| 10347611 | Semiconductor packages having redistribution substrate | Jichul Kim, Jae Choon Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho | 2019-07-09 |
| 8448506 | Adhesion test method using elastic plate | Ho-Jeong Moon | 2013-05-28 |
| 7777308 | Integrated circuit packages including sinuous lead frames | Se Young Yang, Sun-Won Kang | 2010-08-17 |