Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862589 | Wafer-level package including under bump metal layer | Yeo-Hoon Yoon | 2024-01-02 |
| 11810878 | Wafer-level package including under bump metal layer | Yeo-Hoon Yoon | 2023-11-07 |
| 11789141 | Omnidirectional sensor fusion system and method and vehicle including the same | Hoon Hui Lee, Sang Bok Won, Bo Young Yun, Seul Ki Han, Ji Eun Won +1 more | 2023-10-17 |
| 11328516 | Apparatus and method for associating sensor data in vehicle | Hoon Hui Lee, Bo Young Yun, Seul Ki Han, Ji Eun Won, Uk Il Yang | 2022-05-10 |
| 11307292 | ODM information reliability determination system and method and vehicle using the same | Su Min Jo, Ji Eun Won, Sang Bok Won, Min Kyun Yoo, Jae Pil Hwang +6 more | 2022-04-19 |
| 11287525 | Apparatus and method for identifying short cut-in vehicle and vehicle using the same | Hoon Hui Lee, Ji Eun Won, Dong Gu Lee, Sang Bok Won, Min Kyun Yoo +15 more | 2022-03-29 |
| 11255285 | Vehicle and method of controlling engine start for the same | — | 2022-02-22 |
| 11107783 | Wafer-level package including under bump metal layer | Yeo-Hoon Yoon | 2021-08-31 |
| 10647316 | Apparatus and method for deciding a maneuver of a nearby vehicle | Hoon Hui Lee, Uk Il Yang, Ji Eun Won, Seul Ki Han, Bo Young Yun +3 more | 2020-05-12 |
| 8852988 | Semiconductor package and method of manufacturing the same | Woon-Seong Kwon, Tae-Je Cho, Un-Byoung Kang, Jung-Hwan Kim | 2014-10-07 |
| 8563349 | Method of forming semiconductor device | Jong-Yun Myung, Hyuek Jae Lee, Ji-Sun Hong, Tae-Je Cho, Un-Byoung Kang +3 more | 2013-10-22 |
| 8558371 | Method for wafer level package and semiconductor device fabricated using the same | JiSun Hong, Taeje Cho, Un-Byoung Kang, Hyuekjae Lee, Youngbok Kim | 2013-10-15 |
| 8466527 | Semiconductor package and method of manufacturing the same | Woon-Seong Kwon, Tae-Je Cho, Un-Byoung Kang, Jung-Hwan Kim | 2013-06-18 |
| 8304288 | Methods of packaging semiconductor devices including bridge patterns | Hyuek Jae Lee, Ji-Sun Hong, Tae-Je Cho, Jong-Yun Myung, Young Bok Kim +1 more | 2012-11-06 |
| 8125042 | Semiconductor package and method of manufacturing the same | Jung-Hwan Kim, Un-Byoung Kang, Dong Yi, Woonseong Kwon, Jongkeun Jeon +2 more | 2012-02-28 |
| 8114701 | Camera modules and methods of fabricating the same | Woon-Seong Kwon, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee | 2012-02-14 |
| 7948555 | Camera module and electronic apparatus having the same | Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee, Woon-Seong Kwon | 2011-05-24 |
| 7893514 | Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package | Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee | 2011-02-22 |
| 7884392 | Image sensor having through via | Hyuek Jae Lee, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee +1 more | 2011-02-08 |
| 7786581 | Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device | Un-Byoung Kang, Yong-Hwan Kwon, Chung-Sun Lee, Woon-Seong Kwon | 2010-08-31 |
| 7619315 | Stack type semiconductor chip package having different type of chips and fabrication method thereof | Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Chung-Sun Lee | 2009-11-17 |