Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256181 | Package substrates | Jingyu Kim, Taehun Kim, Byungmoon Bae, Se-Ho You | 2019-04-09 |
| 10032706 | Package substrates | Jingyu Kim, Taehun Kim, Byungmoon Bae, Se-Ho You | 2018-07-24 |
| 9112062 | Semiconductor device and method of manufacturing the same | Hyunki Kim, Jongbo Shim, Seokwon Lee, Kyoungsei Choi | 2015-08-18 |
| 8558371 | Method for wafer level package and semiconductor device fabricated using the same | Taeje Cho, Un-Byoung Kang, Hyuekjae Lee, Youngbok Kim, Hyung-Sun Jang | 2013-10-15 |