Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062605 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Eunhee Jung | 2024-08-13 |
| 11798889 | Methods of manufacturing semiconductor packages | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jongbo Shim | 2023-10-24 |
| 11658107 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Eunhee Jung | 2023-05-23 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Jongbo Shim +3 more | 2023-02-14 |
| 11482554 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun | 2022-10-25 |
| 11404382 | Semiconductor package including an embedded semiconductor device | Jihwang Kim, Jeongmin Kang, Hyunkyu Kim, Jongbo Shim | 2022-08-02 |
| 11367688 | Semiconductor package with interposer | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jongbo Shim | 2022-06-21 |
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Eunhee Jung | 2022-06-21 |
| 10868073 | Method of fabricating semiconductor package | Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun | 2020-12-15 |
| 10825776 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Heeseok Lee | 2020-11-03 |
| 10756055 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Yungcheol Kong | 2020-08-25 |
| 10262971 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Yungcheol Kong | 2019-04-16 |
| 10211159 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Heeseok Lee | 2019-02-19 |
| 10177188 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun | 2019-01-08 |
| 9601445 | Semiconductor packages | Ji-Yong Park, Woonbae Kim | 2017-03-21 |
| 9425156 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Heeseok Lee | 2016-08-23 |
| 9355931 | Package-on-package devices and methods of manufacturing the same | Jongkook Kim, Jangwoo Lee, Sayoon Kang, Donghan Kim, Hwanggil Shim | 2016-05-31 |
| 9112062 | Semiconductor device and method of manufacturing the same | JiSun Hong, Hyunki Kim, Jongbo Shim, Seokwon Lee | 2015-08-18 |
| 8940584 | Semiconductor packages and methods of forming the same | Tongsuk Kim, Jangwoo Lee, Heeseok Lee | 2015-01-27 |
| 8748228 | Semiconductor packages and methods of forming the same | Tongsuk Kim, Jangwoo Lee, Heeseok Lee | 2014-06-10 |
| 8692349 | Semiconductor devices and methods of controlling temperature thereof | Jae Choon Kim, Eunseok Cho, Mi-Na Choi, Heejung Hwang, Seran Bae | 2014-04-08 |
| 8350158 | Tape wiring substrates and packages including the same | Yechung Chung, Chulwoo Kim, Eunseok Song | 2013-01-08 |
| 8198722 | Semiconductor package | Youngsang Cho, Donghan Kim, Daewoo Son, Yechung Chung | 2012-06-12 |