Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381169 | Semiconductor package | Soojeoung Park, Hei Seung Kim | 2025-08-05 |
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heejung CHOI, Junso Pak, Bongwee YU | 2025-02-11 |
| 12213256 | Semiconductor package for improving power integrity characteristics | Junghwa KIM, Junso Pak, Moonseob Jeong, Jisoo Hwang | 2025-01-28 |
| 11908810 | Hybrid semiconductor device and electronic device | Heungkyu Kwon, Junso Pak | 2024-02-20 |
| 11908774 | Semiconductor package including composite molding structure | Yunhyeok Im | 2024-02-20 |
| 11908758 | Semiconductor package including dual stiffener | Heungkyu Kwon, Junso Pak | 2024-02-20 |
| 11854985 | Semiconductor package and method of manufacturing the same | Heejung CHOI, Junghwa KIM | 2023-12-26 |
| 11837581 | Semiconductor package | Youngsang Cho, Yunhyeok Im, Moonseob Jeong | 2023-12-05 |
| 11830813 | Semiconductor devices including power connection lines | Jisoo Hwang, Chunguan Kim, Kyoungkuk Chae | 2023-11-28 |
| 11764182 | Semiconductor package and semiconductor device including the same | Jun So Pak, Junghwa KIM, Moonseob Jeong | 2023-09-19 |
| 11728274 | Semiconductor package and method of manufacturing the same | Junghwa KIM | 2023-08-15 |
| 11502061 | Semiconductor package | Youngsang Cho, Yunhyeok Im, Moonseob Jeong | 2022-11-15 |
| 11373933 | Semiconductor package including composite molding structure | Yunhyeok Im | 2022-06-28 |
| 11165143 | Antenna module and electronic system including the same | Junghwa KIM | 2021-11-02 |
| 10825776 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Kyoungsei Choi | 2020-11-03 |
| 10211159 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Kyoungsei Choi | 2019-02-19 |
| 9830973 | Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure | Keung Beum Kim, HyunJong Moon, Seung-Yong Cha | 2017-11-28 |
| 9799591 | Semiconductor packages including thermal blocks | Seung-Yong Cha, Keung Beum Kim, Yonghoon Kim, HyunJong Moon | 2017-10-24 |
| 9721644 | Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure | Keung Beum Kim, HyunJong Moon, Seung-Yong Cha | 2017-08-01 |
| 9659852 | Semiconductor package | Tongsuk Kim, HyunJong Moon, Tai-Hyun Eum, Keung Beum Kim, Yonghoon Kim +2 more | 2017-05-23 |
| 9560767 | Wiring boards and semiconductor modules including the same | Yonghoon Kim, Seung Hwan Kim | 2017-01-31 |
| 9425156 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Kyoungsei Choi | 2016-08-23 |
| 9324657 | Semiconductor package and method of fabricating the same | Jangmee Seo, Jong Won Lee | 2016-04-26 |
| 9030838 | Package substrate and semiconductor package having the same | Se-Ho You, Chiyoung Lee, Yun-Hee Lee | 2015-05-12 |
| 8940584 | Semiconductor packages and methods of forming the same | Tongsuk Kim, Jangwoo Lee, Kyoungsei Choi | 2015-01-27 |