Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heejung CHOI, Heeseok Lee, Bongwee YU | 2025-02-11 |
| 12213256 | Semiconductor package for improving power integrity characteristics | Junghwa KIM, Heeseok Lee, Moonseob Jeong, Jisoo Hwang | 2025-01-28 |
| 11908758 | Semiconductor package including dual stiffener | Heungkyu Kwon, Heeseok Lee | 2024-02-20 |
| 11908810 | Hybrid semiconductor device and electronic device | Heungkyu Kwon, Heeseok Lee | 2024-02-20 |