Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224260 | Semiconductor package including a dualized signal wiring structure | Heeseok Lee, Junso Pak, Bongwee YU | 2025-02-11 |
| 11854985 | Semiconductor package and method of manufacturing the same | Heeseok Lee, Junghwa KIM | 2023-12-26 |