Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764182 | Semiconductor package and semiconductor device including the same | Junghwa KIM, Heeseok Lee, Moonseob Jeong | 2023-09-19 |
| 11257741 | Semiconductor package | Bo-Yu Pu, Sung Wook Moon | 2022-02-22 |
| 11205614 | Stack packages | Seungki Nam, Jiyoung Park, Bo-Yu Pu | 2021-12-21 |
| 11080460 | Method of modeling high speed channel in semiconductor package, method of designing semiconductor package using the same and method of manufacturing semiconductor package using the same | Bo-Yu Pu | 2021-08-03 |
| 9459309 | Test device, semiconductor device and testing method thereof | Jun Ho Lee, Joung-Ho Kim | 2016-10-04 |