Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Jongkook Kim — 15 Patents

Samsung: 15 patents #9,197 of 75,807Top 15%
Suwon-si, KR: #2,386 of 18,685 inventorsTop 15%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Jongkook Kim has been granted 15 US patents while listed as an inventor at Samsung. The first was granted in 2012 and the most recent in August 2025. Jongkook Kim ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Jongkook Kim in Suwon-si, KR.

Patents per Year

Patents granted per year, 2012 to 2025Bar chart with a peak of 5 patents in 2016.peak 52012: 1 patents20122013: 1 patents20132014: 1 patents20142016: 5 patents20162018: 1 patents20182019: 2 patents20192020: 1 patents20202021: 1 patents20212023: 1 patents20232025: 1 patents2025

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12388046 Semiconductor package Hongwon KIM, JunMo Koo, Yeonjoo Kim, Yunhee Kim, Doohwan Lee +1 more 2025-08-12
11828791 Test board and test apparatus including the same Kijae Song, Dongho Lee, Seonmi Lee 2023-11-28
10950521 Thermal interface material layer and package-on-package device including the same Min-Ok Na, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee 2021-03-16
10825776 Semiconductor packages having semiconductor chips disposed in opening in shielding core plate Yoonha Jung, Bona Baek, Heeseok Lee, Kyoungsei Choi 2020-11-03
10431522 Thermal interface material layer and package-on-package device including the same Min-Ok Na, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee 2019-10-01
10211159 Semiconductor packages having semiconductor chips disposed in opening in shielding core plate Yoonha Jung, Bona Baek, Heeseok Lee, Kyoungsei Choi 2019-02-19
9899294 Thermal interface material layer and package-on-package device including the same Min-Ok Na, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee 2018-02-20
9425156 Semiconductor packages having semiconductor chips disposed in opening in shielding core plate Yoonha Jung, Bona Baek, Heeseok Lee, Kyoungsei Choi 2016-08-23
9370098 Package substrates and integrated circuit packages including the same Byoung Wook Jang, Su-Min Park 2016-06-14
9355931 Package-on-package devices and methods of manufacturing the same Jangwoo Lee, Kyoungsei Choi, Sayoon Kang, Donghan Kim, Hwanggil Shim 2016-05-31
9252095 Semiconductor package and method of fabricating the same Su-Min Park, Soojeoung Park, Bona Baek, Hohyeuk Im, Byoungwook Jang +1 more 2016-02-02
9252031 Semiconductor package and method of fabricating the same Hohyeuk Im, Gowoon Seong, Seokwon Lee, Byoungwook Jang, Eunseok Cho 2016-02-02
8623743 Semiconductor chips having guard rings and methods of fabricating the same Jung-Do Lee, Seokwon Lee, Jaesik Lee, Hohyeuk Im, Su-Min Park 2014-01-07
8354735 Semiconductor chips having guard rings and methods of fabricating the same Jung-Do Lee, Seok-Won Lee, Jaesik Lee, Hohyeuk Im, Su-Min Park 2013-01-15
8304876 Semiconductor package and method for manufacturing the same Hak-Kyoon Byun, Taehoon Kim, Sang-Uk Han, Jung-Do Lee, Seonhyang You 2012-11-06

Frequent Collaborators

Hohyeuk Im4 shared
Su-Min Park4 shared
Kyoungsei Choi4 shared
Yoonha Jung4 shared
Bona Baek4 shared
Jangwoo Lee4 shared

Nearby-Ranked Inventors

Naoya Kasahara15
Aaron Larry Snyder15
Avishay Meron15
Stuart Hatfield15
Satoshi KUNIYASU15
Ashton Mason15
Theodore Yuchiang Cheng15
Richard Sharbaugh15
Rajen Bhatt15